Inspection Intelligence For Yield DecisionsaFrom Detection to Decision
By connecting Panel, Strip, and Tray inspection systems with AI inspection and filtering, IVS/ICS verification, and Pixel Master recipe management, PIXEL helps improve defect detection performance and decision-making efficiency in high-volume production.
Product portfolio
Business areas
Advanced Package Substrate Inspection
Precision inspection of fine visual defects in solder resist (SR) and metal pattern areas across Panel, Strip, and Unit stages of FC-BGA package substrates used in AI servers and high-performance computing (HPC) applications.
Advanced Glass Substrate Inspection
Optical systems and image processing technologies tailored to glass substrates enable precision inspection of key visual defects, including via holes and cracks, in next-generation semiconductor packaging.
Precision Wafer Surface Inspection
High-resolution optical imaging enables precise inspection of surface anomalies and fine visual defects on wafers used in advanced semiconductor manufacturing processes.
Combine Color, UV, IR, Dent optics per process to secure defect detection data.
AI inspection for critical areas and OK/NG defect filtering to improve detection and reduce operator review load.
Image-based verify and precision re-imaging to improve final OK / NG accuracy.
Combine Color, UV, IR, Dent optics per process to secure defect detection data.
AI inspection for critical areas and OK/NG defect filtering to improve detection and reduce operator review load.
Image-based verify and precision re-imaging to improve final OK / NG accuracy.
Business areas
